Layer Count Material Final Thickness Max Board Size 2-layer 4-layer 6-layer 8-layer 10-layer 12-layer Finish Plating Finished CU weight Outer Layers Ground plane inner layers Signal inner layers Minimum space & trace Outer layers Inner Layers Inner layer clearances Smallest finished hole size Gold fingers Soldermask Type LPI Soldermask Colors Silkscreen\Legend Options CNC Functions Other Services Quality and Testing	2 to 24 FR4 (GED 130 Tg 135C) FR404 (prepreg) Tg 150C 2 layer .010" min. .125" max 4 layer .020" min. .125" max 6 layer .031" min .125" max 8 layer and up .062" min .200" max 16 x 22 16 x 22 16 x 22 12 x 18 10 x 16 SMOBC Bare Copper Deep Gold 1 oz min 3 oz max .5 oz min 3 oz max .5 oz min 2 oz max 1 oz cu .004” 2 oz cu .006” 3 oz cu .010” .5 to 2 oz .005” 0.012 Final thickness <.093" .010" hole Final thickness .093" .012" hole Final thickness .125" .015" hole 1 edge 2 edges LPI Green Blue Black Red Clear White Yellow Min line width .008" Black Scoring Panel Edge to Panel Edge Plated Slots Controlled Impedance Controlled Dielectric  Tented Vias Epoxy filled Vias Silver filled Vias       Inspect to IPC class 2 Inspect to IPC class 3 Minimum smd pitch for testing of .015"	FR406/MLF170 Tg 170C FR408 Tg 180C GML1000 Arlon Arlon 35 N Arlon 25 Duroid Polymide Cem1 Cem3 Getek Rogers 4000 series Rogers 5000 series Rogers 6000 series Rogers Ultralam 2000 36 X 42 22 x 28 18 x 22 18 x 22 10 x 16 White Tin Immersion Gold Nickel 4 oz 4 oz cu .010” 0.008 Final thickness SR1000 Top & Bottom mix Side to side mix Carbon Ink Skip Scoring Blind or Burried vias (Sequential Lamination) Controlled z axis rout Plated Edges Via Caps Verification of gerber files to customer provided net list

 

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MULTILAYER LAMINATION

Maximum Board Size: 30"X42"
Maximum number of layers: 24
Maximum board thickness: .200"
Panel Thickness tolerances
Panel Thickness
Tolerances

.015"-.030"
+/- 10%

>.031"
+/- 10%

MATERIALS

Laminate per IPC-4101 with the follownig parameters:
Material types used
Name
Max Tg (C)

FR404
140

FR-406
160

FR-408
180

Getek ML200/Nelco N4000-13
>180

Polyimide
235

Arlon 85N
250


Rogers 4003

Inner layer copper cladding
Maximum cu weight (planes)
3 oz

Maximum cu weight (signals)
3 oz

Minimum cu weight
1/2 oz

Outer layer copper cladding
Maximum cu weight
4 oz

Minimum cu weight
1/8 oz

Etching

Cupric Chloride Etching (inner)
Ammonia Etching (outer)
Minimum conductor width: .002"
Minimum feature spacing: .003"
Finished conductor widths from the original artwork
Cu weight
Internal
External

1 oz and below
+.001"
+.001"

2 oz
+/-.002"
+/-.002"

Drilling

Buried & Blind Vias
Minimum drilled hole size: .008" (Finished .004")
Minimum slot width size: .029" (Finished .025")

Minimum hole size tolerances
Hole size
Unplated
Plated

< .040"
+/- .001"
+/- .002"

.040"-.093"
+/- 0015"
+/- .003"

.094"-.257"
+/- 002"
+/- .004"

Minimum distance, edge to edge, from plated hole to internal circuitry or plane: .010"
Minimum distance, edge to edge, from non-plated hole to circuitry: .010" internal/.007" external
Standard finished minimum annular ring if not specified otherwise: .001"
Desired Minimum pad size is .014" over hole dia.
Tighter annular ring is possible with teardrops or by reducing finished annular ring requirements.
Controlled depth drill available

Plating

Maximum Hole Aspect Ratio: 12:1
(SMOBC) Soldermask over bare copper, HASL/Immersion Tin
SMOBC with OSP, ENTEK Coating 106a
Immersion Gold, Selective or Full Body
Electroless Gold, Selective or Full Body
Electrolytic Gold, Selective or Full Body
Soft Bondable Gold, Selective or Full Body

Layer Constructions/Impedance Design

Minimum core thickness: .004"
Minimum dielectric: .0035" (2113)
Impedance stack-up design and verification service
Buried and blind vias
Sequential lamination structure
Differential Impedance

Fabrication

Tolerance on overall dimensions: +/- .005"
Minimum inside radius: .015"
Scoring, In-board Beveling, Beveling
Countersinking, Counter-boring, Edge Milling

Soldermask/ Legend

Per IPC-SM-840
Wet types: SR1000, SR1020, SR2030
LPI
Dry Film types: Dupont Vacrel, 8000 series
Soldermask colors: Red, Green, Blue, Black, Clear
Minimum clearance: LPI-.002", Dry Film -.003", Wet Mask -.006"
Legend colors: White, Yellow, Black, Red, Orange

Electrical Test

CAD net-list testing (IPC356D)
Electical test parameters compliant with IPC and Bellcore specifications
Probe testing down to 0.006"
Standard test parameters: isolation - 10 meg ohms, continuity - 10 ohms
Voltage up to 250 Volts

Impedance Measurements

Printouts of Impedance measurements
Impedance measurements of specific traces
Single ended and differential impedances

Laboratory

Standard and thermal stress cross-section evaluation (IPC-RB276)
Layer construction verification
Fully equipped chemical analysis lab

Certifications / Quality Systems/ SPC

ISO 9002 (PENDING AUDIT)

Integrated IPQC (In Process Quality Control) and OQC (Outgoing Quality Control) systems
IPC-A-600 trained personnel
Control charts on critical processess

Delivery

Quick Turn Delivery is as fast as 12 hours
Standard Delivery is  5 days
Turn time is based on business days counted in 24 hour cycles

WEEKENDS AVAILABLE FOR SPECIAL REQUIREMENTS

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