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Phone: 408.673.7221 or 408.673.PCB1







. : CAPABILITIES : .

 

  • Mat'ls: FR4, Duriod, Polymide, Getek & Teflon

  • 2 to 24 layer technology

  • Board Final thickness from .010" to .200"

  • Minimum trace and space of .004"

  • Minimum finished hole size .008"

  • Blind and/or Buried vias

  • Finished copper weight from .5 to 4oz

  • Board surface finish: HASL, Gold, & White Tin

  • Plated slots and edges

  • LPI soldermask in a variety of colors

  • Silkscreen/Legend in a variety of colors

  • Controlled dielectric and impedance

  • Scoring, tab, and individual routing

  • Quality Certifications & Training
  • Comprehensive listing of services available
  • Delivery Same Day, 1 Day to 15 Days

  • . : CAPABILITIES DETAIL : .
    Layer Count

    Material


















    Final Thickness





    Max Board Size
    2-layer
    4-layer
    6-layer
    8-layer
    10-layer
    12-layer

    Finish Plating



    Finished CU weight
    Outer Layers
    Ground plane inner layers
    Signal inner layers

    Minimum space & trace
    Outer layers


    Inner Layers

    Inner layer clearances

    Smallest finished hole size



    Gold fingers


    Soldermask Type

    LPI Soldermask Colors





    Silkscreen\Legend Options




    CNC Functions




    Other Services






    Quality and Testing



    2 to 24

    FR4 (GED 130 Tg 135C)
    FR404 (prepreg) Tg 150C

















    2 layer .010" min. .125" max
    4 layer .020" min. .125" max
    6 layer .031" min .125" max
    8 layer and up .062" min .200" max


    16 x 22
    16 x 22
    16 x 22
    12 x 18
    10 x 16


    SMOBC
    Bare Copper
    Deep Gold


    1 oz min 3 oz max
    .5 oz min 3 oz max
    .5 oz min 2 oz max


    1 oz cu .004
    2 oz cu .006
    3 oz cu .010
    .5 to 2 oz .005

    0.012

    Final thickness <.093" .010" hole
    Final thickness .093" .012" hole
    Final thickness .125" .015" hole

    1 edge
    2 edges

    LPI

    Green
    Blue
    Black
    Red
    Clear

    White
    Yellow
    Min line width .008"
    Black

    Scoring Panel Edge to Panel Edge




    Plated Slots
    Controlled Impedance
    Controlled Dielectric
     Tented Vias
    Epoxy filled Vias
    Silver filled Vias      
    Inspect to IPC class 2
    Inspect to IPC class 3
    Minimum smd pitch for testing of .015"


    FR406/MLF170 Tg 170C
    FR408 Tg 180C
    GML1000
    Arlon
    Arlon 35 N
    Arlon 25
    Duroid
    Polymide
    Cem1
    Cem3
    Getek
    Rogers 4000 series
    Rogers 5000 series
    Rogers 6000 series
    Rogers Ultralam 2000











    36 X 42
    22 x 28
    18 x 22
    18 x 22
    10 x 16


    White Tin
    Immersion Gold
    Nickel


    4 oz




    4 oz cu .010




    0.008

    Final thickness






    SR1000

    Top & Bottom mix
    Side to side mix




    Carbon Ink




    Skip Scoring
    Blind or Burried vias
    (Sequential Lamination)
    Controlled z axis rout



    Plated Edges

    Via Caps




    Verification of gerber files to customer provided net list
         

     


     

    MULTILAYER LAMINATION

    Maximum Board Size: 30"X42"
    Maximum number of layers: 24
    Maximum board thickness: .200"
    Panel Thickness tolerances
    Panel Thickness
    Tolerances

    .015"-.030"
    +/- 10%

    >.031"
    +/- 10%



    MATERIALS

    Laminate per IPC-4101 with the follownig parameters:
    Material types used
    Name
    Max Tg (C)

    FR404
    140

    FR-406
    160

    FR-408
    180

    Getek ML200/Nelco N4000-13
    >180

    Polyimide
    235

    Arlon 85N
    250


    Rogers 4003


    Inner layer copper cladding
    Maximum cu weight (planes)
    3 oz

    Maximum cu weight (signals)
    3 oz

    Minimum cu weight
    1/2 oz


    Outer layer copper cladding
    Maximum cu weight
    4 oz

    Minimum cu weight
    1/8 oz


    Etching

    Cupric Chloride Etching (inner)
    Ammonia Etching (outer)
    Minimum conductor width: .002"
    Minimum feature spacing: .003"
    Finished conductor widths from the original artwork
    Cu weight
    Internal
    External

    1 oz and below
    +.001"
    +.001"

    2 oz
    +/-.002"
    +/-.002"



    Drilling

    Buried & Blind Vias
    Minimum drilled hole size: .008" (Finished .004")
    Minimum slot width size: .029" (Finished .025")

    Minimum hole size tolerances
    Hole size
    Unplated
    Plated

    < .040"
    +/- .001"
    +/- .002"

    .040"-.093"
    +/- 0015"
    +/- .003"

    .094"-.257"
    +/- 002"
    +/- .004"

    Minimum distance, edge to edge, from plated hole to internal circuitry or plane: .010"
    Minimum distance, edge to edge, from non-plated hole to circuitry: .010" internal/.007" external
    Standard finished minimum annular ring if not specified otherwise: .001"
    Desired Minimum pad size is .014" over hole dia.
    Tighter annular ring is possible with teardrops or by reducing finished annular ring requirements.
    Controlled depth drill available

    Plating

    Maximum Hole Aspect Ratio: 12:1
    (SMOBC) Soldermask over bare copper, HASL/Immersion Tin
    SMOBC with OSP, ENTEK Coating 106a
    Immersion Gold, Selective or Full Body
    Electroless Gold, Selective or Full Body
    Electrolytic Gold, Selective or Full Body
    Soft Bondable Gold, Selective or Full Body

    Layer Constructions/Impedance Design

    Minimum core thickness: .004"
    Minimum dielectric: .0035" (2113)
    Impedance stack-up design and verification service
    Buried and blind vias
    Sequential lamination structure
    Differential Impedance

    Fabrication

    Tolerance on overall dimensions: +/- .005"
    Minimum inside radius: .015"
    Scoring, In-board Beveling, Beveling
    Countersinking, Counter-boring, Edge Milling

    Soldermask/ Legend

    Per IPC-SM-840
    Wet types: SR1000, SR1020, SR2030
    LPI
    Dry Film types: Dupont Vacrel, 8000 series
    Soldermask colors: Red, Green, Blue, Black, Clear
    Minimum clearance: LPI-.002", Dry Film -.003", Wet Mask -.006"
    Legend colors: White, Yellow, Black, Red, Orange

    Electrical Test

    CAD net-list testing (IPC356D)
    Electical test parameters compliant with IPC and Bellcore specifications
    Probe testing down to 0.006"
    Standard test parameters: isolation - 10 meg ohms, continuity - 10 ohms
    Voltage up to 250 Volts

    Impedance Measurements

    Printouts of Impedance measurements
    Impedance measurements of specific traces
    Single ended and differential impedances

    Laboratory

    Standard and thermal stress cross-section evaluation (IPC-RB276)
    Layer construction verification
    Fully equipped chemical analysis lab

    Certifications / Quality Systems/ SPC


    ISO 9002 (PENDING AUDIT)

    Integrated IPQC (In Process Quality Control) and OQC (Outgoing Quality Control) systems
    IPC-A-600 trained personnel
    Control charts on critical processess

    Delivery

    Quick Turn Delivery is as fast as 12 hours
    Standard Delivery is  5 days
    Turn time is based on business days counted in 24 hour cycles

    WEEKENDS AVAILABLE FOR SPECIAL REQUIREMENTS


    . : LINKS : .

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  • Proto Inspection Criteria


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